Grants to be provided by the respective ministries of Austria, Germany, the Netherlands and RomaniaPlanned investments reinforce NXP’s commitment to strengthening innovation and supply chain resilience in Europe and follows the announcement of a joint venture partnership establishing TSMC’s First European Fab EINDHOVEN, The Netherlands, Sept.

奥地利，德国，荷兰和罗马尼亚各自部门提供的赠款计划投资加强了NXP在欧洲加强创新和供应链复原力的承诺，并于9月宣布建立TSMC第一个欧洲工厂埃因霍温的合资伙伴关系后成立。

19, 2023 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced it is strengthening its European research and development (R&D) through grants to be provided via the 2nd Important Project of Common European Interest on Microelectronics and Communication Technologies (IPCEI ME/CT), with the final investment decision pending confirmation of the level of public funding.

192023年（GLOBE NEWSWIRE）-NXP Semiconductors N.V.（纳斯达克股票代码：NXPI）今天宣布通过欧洲微电子通信共同利益第二个重要项目（IPCEI ME/CT）提供赠款，加强其欧洲研发（R＆D），最终投资决定有待确认公共资金水平。

Dedicated NXP teams across Austria, Germany, the Netherlands and Romania will innovate in core technologies across automotive, industrial and cybersecurity. This includes 5nm, advanced driving assistance and battery management systems in automotive, 6G and Ultra-Wideband as well as artificial intelligence (AI), RISC-V and post-quantum cryptography.

奥地利，德国，荷兰和罗马尼亚的专业NXP团队将在汽车，工业和网络安全领域的核心技术方面进行创新。这包括5nm，汽车，6G和超宽带的先进驾驶辅助和电池管理系统，以及人工智能（AI），RISC-V和后量子密码学。

“NXP’s planned investments in our Austrian, German, Dutch, and Romanian operations signal our strong commitment to the EU’s goal of enabling both digital and green transition,” said Kurt Sievers, President and CEO of NXP. “Our activities through IPCEI ME/CT complement NXP’s planned joint venture participation in TSMC’s first European foundry.

NXP总裁兼首席执行官库尔特·西弗斯（Kurt Sievers）说：“NXP计划投资于奥地利，德国，荷兰和罗马尼亚的运营，这表明我们对欧盟实现数字和绿色转型目标的坚定承诺。“我们通过IPCEI ME/CT开展的活动补充了NXP计划合资参与TSMC第一家欧洲铸造厂的计划。

It also underscores our commitment to strengthening innovation and supply chain resilience in Europe. NXP believes expanding research, development, and manufacturing efforts in Europe is of vital importance, and each of these three critical elements must be successfully integrated to achieve greater European semiconductor ecosystem resilience.” Extensive research, .

它还强调了我们对加强欧洲创新和供应链复原力的承诺。NXP认为，在欧洲扩大研究，开发和制造工作至关重要，必须成功整合这三个关键要素中的每一个，以实现更大的欧洲半导体生态系统弹性。”广泛的研究。