FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP).

加利福尼亚州弗里蒙特，2024年8月7日（环球通讯社）--ACM Research，Inc.（ACM）（纳斯达克：ACMR），半导体和先进晶圆级封装应用的晶圆加工解决方案的领先供应商，今天宣布了其新的面板电化学镀（Ultra-ECP ap-p）工具，该工具专为扇出面板级封装（FOPLP）设计。

This new tool employs a horizontal plating approach achieving exceptional uniformity and precision across the entire panel. “As demands for low latency, high bandwidth and cost-efficiency in semiconductor chips intensify, advanced packaging technologies like FOPLP are becoming increasingly critical,” said Dr.

这种新工具采用水平电镀方法，在整个面板上实现了非凡的均匀性和精度。“随着半导体芯片对低延迟、高带宽和成本效益的需求加剧，像FOPLP这样的先进封装技术变得越来越重要，”Dr。

David Wang, ACM’s President and Chief Executive Officer. “We believe FOPLP, with its capability to facilitate high-density, high bandwidth chip-to-chip connections, offers substantial growth prospects. We believe the Ultra ECP ap-p tool is amongst the first to employ horizontal plating for panel applications, drawing upon ACM’s deep-rooted expertise in wafer plating and copper processes.

ACM总裁兼首席执行官David Wang。“我们相信FOPLP能够促进高密度、高带宽的芯片间连接，具有巨大的增长前景。我们相信Ultra ECP ap-p工具是首批将水平电镀应用于面板应用的工具之一，它利用了ACM在晶圆电镀和铜工艺方面根深蒂固的专业知识。

We believe the tool will strengthen the market, enabling advanced packaging with sub-micron features on large panels, which are especially applicable to GPUs and high-density high bandwidth memory (HBM).” The Ultra ECP ap-p tool supports 515mm x 510mm panel sizes, with an option to expand to 600mm x 600mm.

我们相信该工具将巩固市场，在大型面板上实现亚微米功能的高级封装，特别适用于GPU和高密度高带宽内存（HBM）。”Ultra ECP ap-p工具支持515mm x 510mm的面板尺寸，可以扩展到600mm x 600mm。

It is compatible with both organic and glass substrates and includes capabilities for copper (Cu) via filling, Cu pillar, nickel (Ni), tin-silver (SnAg) plating, and solder bumping. It accommodates high-density fan-out (HDFO) products requiring Cu, Ni, SnAg and gold plating. ACM’s proprietary technology optimizes the management of electrical fields, ensuring consistent and uniform plating across the panel.

它与有机基板和玻璃基板兼容，包括通过填充、铜柱、镍（Ni）、锡银（SnAg）电镀和焊料凸点实现铜（Cu）的功能。它适用于需要镀铜、镍、锡和镀金的高密度扇形输出（HDFO）产品。ACM的专有技术优化了电场管理，确保了整个面板的一致性和均匀性。

The horizontal configuration of the tool r.

刀具r的水平配置。