TORONTO, Oct. 16, 2023 (GLOBE NEWSWIRE) -- Celestica Inc. (TSX: CLS) (NYSE: CLS), a leader in design, manufacturing, hardware platform and supply chain solutions for the world’s most innovative companies, today launched its DS5000 high-performance 800GbE switch, delivering speed and agility for data center and enterprise-class access deployments.

多伦多，2023年10月16日（GLOBE NEWSWIRE）-Celestica Inc.（TSX:CLS）（NYSE:CLS），是世界上最具创新性的公司的设计，制造，硬件平台和供应链解决方案的领导者，今天推出了DS5000高性能800GbE交换机，为数据中心和企业级访问部署提供速度和灵活性。

We are seeking approval to release the DS5000 into the open source domain as the first Open Compute Project (OCP)-inspired commercial 800G Ethernet switch contribution to the OCP Networking group.   The DS5000 switch will be on display at this week’s 2023 OCP Global Summit. It is the newest addition to Celestica’s Hardware Platform Solutions (HPS) portfolio of cutting-edge storage, compute, networking, and webscale solutions.

我们正在寻求批准将DS5000发布到开源领域，作为第一个开放计算项目（OCP）启发的商业800G以太网交换机对OCP网络组的贡献。DS5000交换机将在本周的2023 OCP全球峰会上展出。它是Celestica硬件平台解决方案（HPS）尖端存储，计算，网络和网络规模解决方案组合的最新补充。

It features 64 OSFP 800GbE ports, providing a 51.2 Tbps Ethernet-based fabric solution within a 2U form factor to deliver next-generation, high-performance networking.  Helping to power AI, ML and data center connectivity, the DS5000 is based on the Broadcom StrataXGS® Tomahawk® 5 Ethernet switch chip, which provides the radix of 400GbE ports with an astounding 128 ports supported on a single chip, enabling flat, low latency AI/ML clusters.

它具有64个OSFP 800GbE端口，以2U外形提供51.2 Tbps基于以太网的织物解决方案，以提供下一代高性能网络。DS5000有助于为AI，ML和数据中心连接供电，基于BroadComStrataxGS®Tomahawk®5以太网交换机芯片，提供400GbE端口的基础，单个芯片支持惊人的128个端口，实现平坦，低延迟AI/ML群集。

In addition, the DS5000 enables next-gen power efficiency, offering more than 75% power reduction from previous generation 400G switches.   The DS5000 is optimized for:  AI/ML and Big Data Analytics  Hyperscale Data Centers and Cloud ComputingHigh-Performance Computing (HPC)Network Backbone (800GbE Data Center Leaf / Spine) 'Celestica's innovations in engineering and manufacturing continue to deliver networking, storage, and compute solutions to meet our cloud and enterprise customers' accelerating needs for infrastructure performance and scalability,' said Gavin Cato.

此外，DS5000可实现下一代功率效率，比上一代400G开关降低75%以上的功率。DS5000经过优化：AI/ML和大数据分析超尺度数据中心和云计算高性能计算（HPC）网络骨干（800GbE数据中心叶/脊柱）'Celestica在工程和制造方面的创新继续提供网络，存储，Gavin Cato说，并计算解决方案以满足我们的云和企业客户对基础架构性能和可伸缩性的加速需求。