博通创新推出Sian3和Sian2M新型DSP，降低可扩展AI/ML连接的功耗-动脉网

Broadcom Innovates with New Sian3 and Sian2M DSPs, Cutting Power for Scalable AI/ML Connectivity

benzinga 等信源发布 2025-03-25 10:56

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Broadcom Inc.

博通公司

AVGO

安华高科

on Tuesday disclosed the expansion of its leading 200G/lane DSP PHY portfolio with the

周二披露了其领先的200G/lane DSP PHY产品组合的扩展。

introduction of the Sian3 and Sian2M

Sian3和Sian2M的介绍

。

The portfolio is designed specifically to meet the connectivity demands of AI/ML clusters.

该产品组合专为满足人工智能/机器学习集群的连接需求而设计。

These advancements address the critical need for optimized power management across both single-mode fiber (SMF) and short-reach multi-mode fiber (MMF) links, particularly in 800G and 1.6T optical transceiver applications.

这些进展满足了在单模光纤（SMF）和短距离多模光纤（MMF）链路中优化电源管理的关键需求，特别是在800G和1.6T光收发器应用中。

Broadcom’s new Sian3 and Sian2M DSPs, combined with its comprehensive 200G/lane laser portfolio, offer exceptional power efficiency and cost optimization, supporting the next generation of AI infrastructure.

博通全新的Sian3和Sian2M DSP结合其全面的200G/通道激光器产品组合，提供卓越的电源效率和成本优化，支持下一代人工智能基础设施。

Broadcom's Sian3 reduces power by over 20% compared to the Sian2.

Broadcom的Sian3相比Sian2功耗降低了20%以上。

The Sian2M is optimized for 800G and 1.6T short-reach MMF links in AI clusters, integrating VCSEL drivers and Broadcom's 200G VCSEL technology to boost performance and efficiency. Broadcom has deployed over 50 million channels of 100G VCSELs in AI networks.

Sian2M针对AI集群中的800G和1.6T短距离多模光纤链路进行了优化，集成了VCSEL驱动器和博通的200G VCSEL技术，以提升性能和效率。博通已在AI网络中部署了超过5000万通道的100G VCSEL。

Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom said, “Our new 3nm Sian3 delivers over 20% power reduction for 1.6T optical modules, while Sian2M with integrated VCSEL drivers and 200G VCSELs brings cost and power efficiency to short-reach links.

博通公司物理层产品部门副总裁兼总经理Vijay Janapaty表示：“我们的新款3nm Sian3可为1.6T光模块提供超过20%的功耗降低，而集成了VCSEL驱动器和200G VCSEL的Sian2M则为短距离链路带来了成本和功耗效率。”

These innovations enable our customers to scale AI clusters to meet the demands of growing AI workloads.”.

这些创新使我们的客户能够扩展 AI 集群，以满足不断增长的 AI 工作负载需求。"

Investors can gain exposure to the stock via

投资者可以通过以下方式获得该股票的敞口：

EA Series Trust Strive U.S. Semiconductor ETF

EA系列信托努力美国半导体ETF

SHOC

and

和

VanEck Fabless Semiconductor ETF

范埃克无晶圆厂半导体ETF