Ansys热学和多物理场解决方案获认证支持英特尔18A工艺和3D-IC设计-动脉网

Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs

CISION 等信源发布 2025-04-30 00:00

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3D simulation of an interposer connecting the High Bandwidth Memory (HBM) module to the die in Ansys HFSS IC™

在Ansys HFSS IC™中进行连接高带宽内存（HBM）模块与芯片的中介层的3D仿真

Ansys logo. (PRNewsFoto/ANSYS, Inc.)

Ansys标志。(PRNewsFoto/ANSYS, Inc.)

Signoff certification includes power integrity, multi-die thermal reliability, and electromagnetic modeling for AI and HPC applications

签核认证包括功率完整性、多芯片热可靠性以及面向人工智能和高性能计算应用的电磁建模。

Key Highlights

关键亮点

Ansys RedHawk-SC™

and

和

Ansys Totem™

power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology

电源完整性签核平台和 Ansys HFSS-IC™ Pro 电磁仿真软件已通过英特尔 18A 晶体管工艺技术的认证。

Ansys and Intel Foundry deliver a thermal and multiphysics signoff flow for Intel Foundry's Embedded Multi-Die Interconnect Bridge (EMIB) technology, including

Ansys 和 Intel Foundry 为 Intel Foundry 的嵌入式多芯片互连桥 (EMIB) 技术提供了一个热学和多物理场签核流程，包括

Ansys RedHawk-SC Electrothermal™

signoff platform, and

签署平台，以及

Ansys SIwave™

package electromagnetics simulation software and HFSS-IC Pro for signal integrity signoff and extending EMIB-T

封装电磁仿真软件和HFSS-IC Pro用于信号完整性签核，并扩展EMIB-T

Ansys joins the Intel Foundry Chiplet Alliance to enable an interoperable, secure ecosystem for designing multi-die heterogenous systems

Ansys加入英特尔代工芯片联盟，以实现一个可互操作、安全的多芯片异构系统设计生态系统。

Ansys is progressing certification for Intel 18A-P and collaborating on enablement for Intel 14A-E

Ansys 正在推进针对 Intel 18A-P 的认证，并在 Intel 14A-E 的启用方面展开合作。

PITTSBURGH

匹兹堡

，

April 29, 2025

2025年4月29日

/PRNewswire/ --

/美通社/ --

Ansys

安sys

(NASDAQ:

（纳斯达克：

ANSS

ANSYS

) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of advanced semiconductor systems for the most demanding applications — including AI chips, graphic processing units (GPUs), and high-performance computing (HPC) products.

）今天宣布了针对采用英特尔18A工艺技术制造的设计的热学和多物理场签核工具认证。这些认证有助于确保最先进的半导体系统在最苛刻的应用中的功能和可靠性——包括AI芯片、图形处理单元（GPU）和高性能计算（HPC）产品。

Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff analysis flow for Intel Foundry's EMIB technology used for creating multi-die 3D integrated circuit (3D-IC) systems..

英特尔代工服务和 Ansys 还为英特尔代工服务用于创建多芯片 3D 集成电路 (3D-IC) 系统的 EMIB 技术启用了全面的多物理场签核分析流程。

Recognized as industry-leading solutions, RedHawk-SC and Totem deliver speed, accuracy, and capacity to analyze the power integrity and reliability of Intel 18A RibbonFET Gate-all-around (GAA) transistors with PowerVia backside power delivery. For scalable electromagnetic analysis, Ansys is introducing HFSS-IC Pro, a new addition to the HFSS-IC product family.

RedHawk-SC 和 Totem 被公认为业界领先的解决方案，可为 Intel 18A RibbonFET 全环绕栅极 (GAA) 晶体管提供速度、精度和容量分析，支持通过 PowerVia 技术实现背面供电的电源完整性和可靠性分析。针对可扩展的电磁分析，Ansys 推出了 HFSS-IC Pro，这是 HFSS-IC 产品系列的新成员。

HFSS-IC Pro is certified for modeling on-chip electromagnetic integrity in radio frequency chips, WiFi, 5G/6G, and other telecommunication applications made with the Intel 18A process node..

HFSS-IC Pro 已通过认证，可用于采用 Intel 18A 工艺节点制造的射频芯片、WiFi、5G/6G 及其他电信应用中的片上电磁完整性建模。

EMIB facilitates 3D-IC for high-performance microprocessors, heterogeneous integrated systems, and more, enhancing the performance and integration of advanced computing systems by seamlessly connecting diverse chip types. The flow includes thermal reliability analysis with RedHawk-SC Electrothermal.

EMIB促进了高性能微处理器、异构集成系统等的3D-IC技术，通过无缝连接不同类型的芯片，提升了先进计算系统的性能和集成度。该流程包括使用RedHawk-SC Electrothermal进行热可靠性分析。

Ansys and Intel Foundry are also extending the collaboration to cover next-generation EMIB-T technology that will add through-silicon vias (TSVs) to EMIB. The EMIB-T flow is expanded to include HFSS-IC Pro and SIwave for signal integrity analysis and RedHawk-SC and Totem for power integrity analysis..

Ansys与英特尔代工部门还在扩大合作范围，涵盖下一代EMIB-T技术，该技术将在EMIB中增加硅通孔 (TSV)。EMIB-T流程扩展后将包括用于信号完整性分析的HFSS-IC Pro和SIwave，以及用于电源完整性分析的RedHawk-SC和Totem。

The qualification process for RedHawk-SC, Totem, and HFSS-IC Pro is currently in progress for the Intel 18A high-performance process node (Intel 18A-P). Customers have the option to request the latest Intel PDK to begin early design work and IP development. These solutions are part of the Intel 14A-E process definition and Design Technology Co-Optimization (DTCO)..

RedHawk-SC、Totem 和 HFSS-IC Pro 针对英特尔 18A 高性能工艺节点（Intel 18A-P）的资格认证流程正在进行中。客户可以选择申请最新的英特尔 PDK，以开始早期设计工作和 IP 开发。这些解决方案是英特尔 14A-E 工艺定义和设计技术协同优化 (DTCO) 的一部分。

In addition, Ansys is joining the Intel Foundry Chiplet Alliance, part of the Intel Foundry Accelerator Alliance, to help develop a secure ecosystem for designing and manufacturing interoperable chiplets.

此外，Ansys 还加入了英特尔代工芯片联盟（Intel Foundry Chiplet Alliance），该联盟是英特尔代工加速器联盟（Intel Foundry Accelerator Alliance）的一部分，旨在帮助建立一个安全的生态系统，用于设计和制造可互操作的小芯片。

'Our approach to multi-die assembly is changing the way the industry thinks about stacking chips and designing for efficiency,' said

“我们对多芯片组装的方法正在改变行业对堆叠芯片和设计效率的思考方式，”

Suk Lee

李淑

, vice president & general manager, Ecosystem Technology Office at Intel Foundry. 'Ansys tools are critical in this process because they help our mutual customers validate their designs with extreme accuracy — saving them costs that may not otherwise be recoverable. Furthermore, we are looking forward to Ansys' participation in the Intel Foundry Chiplet Alliance, which is critical to advancing chiplet technology.'.

英特尔代工生态系统技术办公室副总裁兼总经理表示：“Ansys 工具在此过程中至关重要，因为它们帮助我们的共同客户以极高的精度验证其设计 —— 节省了可能无法挽回的成本。此外，我们期待 Ansys 参与英特尔代工小芯片联盟，这对推动小芯片技术的发展至关重要。”

'Ansys' suite of multiphysics simulation tools instill confidence in our customers, ensuring their semiconductor systems achieve the highest levels of thermal, signal, power, and mechanical integrity,' said

“Ansys多物理场仿真工具套件让我们的客户充满信心，确保他们的半导体系统在热、信号、电源和机械完整性方面达到最高水平，”

John Lee

李约翰

, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. 'While customers may adopt various methods for chip design, the need for precise tools and solutions to ensure reliability remains constant — this is where Ansys excels. By joining the Intel Foundry Chiplet Alliance and deepening our collaboration with Intel Foundry, Ansys is delivering on its commitment to providing open-source and interoperable technology in pursuit of engineering excellence.'.

安sys电子、半导体和光学业务部副总裁兼总经理。“虽然客户可能会采用各种方法进行芯片设计，但对确保可靠性的精确工具和解决方案的需求始终不变——这正是Ansys的专长所在。通过加入英特尔代工芯粒联盟并深化与英特尔代工的合作，Ansys正致力于提供开源且可互操作的技术，追求工程卓越。”

/ About Ansys

/ 关于 Ansys

Our Mission: Powering Innovation that Drives Human Advancement™

我们的使命：推动人类进步的创新动力™

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys..

当有远见的公司需要了解其改变世界的想法将如何发挥作用时，他们通过 Ansys 仿真来缩小设计与现实之间的差距。五十多年来，Ansys 软件凭借仿真的预测能力，助力各行各业的创新者突破界限。从可持续交通到先进半导体，从卫星系统到挽救生命的医疗设备，人类进步的下一个伟大飞跃将由 Ansys 提供动力。

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in

Ansys 以及任何和所有 ANSYS, Inc. 品牌、产品、服务和功能名称、徽标及口号均为 ANSYS, Inc. 或其子公司的注册商标或商标。

the United States

美国

or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

或其它国家。所有其他品牌、产品、服务和功能名称或商标均为其各自所有者的财产。

ANSS–T

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/ 联系人

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媒体

Mary Kate Joyce

玛丽·凯特·乔伊斯